Happy Summer 2021. I hope this newsletter finds you enjoying a better year than the last, and as things start to get back to normal in many places around the world, we are starting to visit customers and learn more about their future challenges brought on by the latest semiconductor technology.
The unprecedented levels of demand in the industry have tied up capacity for months in fabrication plans, driven up costs, and made it harder to react to changes in order scheduling and pull-n requests. We have been actively managing and monitoring the supply chain with our partners and I’m happy to report that we’ve been able to support over 98% of what has been thrown at us this year. Demand for our business has been very strong as we release new products that have been in development for years and we continue to tape out the next generation of designs. Last quarter saw two key tapeout milestones achieved, and we are marching hard down the path of finalizing our next generation PE in the fall. Sampling of Rainier will take place for the broader market in the Sept/Oct timeframe, and interest is high in this product – which we fully expect to be the most power efficient, highest performing part we’ve ever made. But honestly, the best is yet to come. We are on the path to make some exciting investments in next generation parts that will change the ATE industry – and we can’t wait to get started! Looking forward to telling you more about what’s next for us as we move into the back half of 2021.